Microelectronics Clean Air Total Solution

Microelectronics Clean Air Total Solution

 
Overall microelectronics solution

Overall microelectronics solution

With China's successful transformation from a "manufacturing giant" to a "quality manufacturing giant", a large number of well-known high-tech manufacturing enterprises have emerged in the country, and many high-tech projects have also been implemented and carried out in many places across the country.

Not long ago, a 12-inch wafer fab that was just built in China will focus on the research and development of 19nm process technology for DRAM (Dynamic Random Access Memory) production. After the project is put into operation, the maximum monthly production capacity will reach 125,000 wafers, effectively filling the gap in China's high-end DRAM manufacturing industry and occupying a place among global DRAM manufacturers.

 

 

 
Safeguard the "Chinese chip"

Safeguard the "Chinese chip"

The commissioning of this project will also drive the comprehensive development of the entire Pearl River Delta region, including equipment, materials, terminals and other aspects. It can be said that the commissioning of this wafer fabrication plant will accelerate the pace of industrial transformation and upgrading in Hefei.

It is reported that by 2025, China will put into operation approximately 25 12-inch wafer projects, breaking the industry monopoly system of foreign companies at one stroke.

 
 
 
 
 
Problems and difficulties

Problems and difficulties

Some difficulties were also encountered during the construction of the factory and the procurement of equipment. From a technical perspective, when using the 19nm process technology to produce DRAM, the yellow light lithography area under this process is extremely sensitive to AMCs gas. Even a slight deviation in the clean air quality in the working area will directly affect the final production yield rate. Therefore, The concentration value of the AMC process environment needs to be strictly controlled throughout the entire production process.

 
 
 
 
Final solution

Final solution

As one of the global leaders in clean air solutions, RZJ has been committed to developing highly efficient and energy-saving filtration solutions for the microelectronics industry for nearly a century, including particulate matter and AMC filtration. Its full range of products covers coarse, medium and high-efficiency air filters, chemical filters, household filters, laminar flow hoods and other purification equipment. In response to the demands of this high-level and complex crystallization process, AAF adopted a solution of FFU loading chemical gas treatment. Two chemical filters were superimposed on top of the FFU, and AMCs on-site sampling tests were provided to quickly and accurately extract and organize the air quality data in the actual environment, and based on this, reasonable solutions were formulated.

 

 

 
Strict quality control and a complete testing system

Strict quality control and a complete testing system

All along, RZJ has taken it as its responsibility to protect the environment, reduce enterprise risks and cut down on air purification expenses. To some extent, the pursuit of excellence in its products also stems from its own practice. AAF itself possesses high-cleanliness grade 10,000-level PTFE cleanrooms, high-efficiency filter cleanrooms, FFU cleanrooms, and industrial and commercial filter production lines. RZJ is equipped with advanced facilities. Production is carried out with standardized production processes and strict quality standards.

Moreover, RZJ has a complete testing system. From coarse, medium and high-efficiency filters to high-efficiency and ultra-high-efficiency filters, as well as filtration equipment, RZJ conducts all-round performance tests on products in accordance with the advanced testing standards of the industry.

 

 

 

From the production perspective, the manufacturing process of microelectronic products is complex and numerous, and many key processes need to be carried out in a dust-free environment with constant temperature, humidity and ultra-cleanliness. Single-part large and medium-sized production equipment will release high-concentration particulate matter and chemical substances, which will cause a decline in the yield of produced products and bring other safety hazards at the same time. Therefore, the microelectronics industry has very high requirements and technical standards for the design and cleanliness effect of industrial cleanrooms during the production process.

SEMI F21-1102 classification system for four types of gaseous pollutants

AMC classification

Concentration grade

 

1pptM

10pptM

100pptM

1000pptM

10000pptM

Acids

MA-1

MA-10

MA-100

MA-1000

MA-100

Alkalis

MB-1

MB-10

MB-100

MB-1000

MB-10000

Condensate

MC-1

MC-10

MC-100

MC-1000

MC-10000

Dopant

MD-1

MD-10

MD-100

MD-1000

MD-10000

The concentration unit is pptM (parts per trillion Modal) of 10-12 trillionths of a mole


Partners:

Hubei Suizhou Polysilicon Technology Co., LTD

 

Shenzhen SeG Samsung Co., LTD

 

Xinli Semiconductor Co., LTD

 

Foxconn Technology Group

 

Guizhou Yunfeng Pharmaceutical Co., LTD

 

Shenzhen Sanlipu Optoelectronic Technology Co., LTD

 

 

Guangzhou Jintian Ruilin Purification Equipment Manufacturing Co., LTD


 

 

Dongguan Chuanyue Packaging Co., LTD